RESIN COMPOSITION FOR INSULATION LAYER OF MULTILAYER PRINTED WIRING BOARD, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, SEMICONDUCTOR DEVICE AND CURED PRODUCT

To provide a resin composition capable of reducing warpage of an entire printed wiring board when used in an insulation layer of a multilayer printed wiring board, a resin sheet using the resin composition, a multilayer printed wiring board, and a semiconductor device.SOLUTION: A resin composition f...

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Bibliographische Detailangaben
Hauptverfasser:	KUMAZAWA YUNE, SUZUKI TAKUYA, YOTSUYA SEIJI, HANAKI YOHEI, KATAGIRI SHUNSUKE
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	To provide a resin composition capable of reducing warpage of an entire printed wiring board when used in an insulation layer of a multilayer printed wiring board, a resin sheet using the resin composition, a multilayer printed wiring board, and a semiconductor device.SOLUTION: A resin composition for an insulation layer of a multilayer printed wiring board has a coefficient of thermal expansion of 70 to 150 ppm/°C at 0 to 30°C, a glass transition temperature of 100°C or less, and a modulus of elasticity of 0.001 to 1.5 GPa at 25°C.SELECTED DRAWING: None 【課題】本発明は、多層プリント配線板の絶縁層に用いた際に、プリント配線板全体の反りを低減することが可能な樹脂組成物、それを用いた樹脂シート、多層プリント配線板、並びに半導体装置を提供することにある。【解決手段】本発明の多層プリント配線板の絶縁層用樹脂組成物は、樹脂組成物の硬化物の、０～３０℃の熱膨張係数が、７０～１５０ｐｐｍ／℃であり、ガラス転移温度が、１００℃以下であり、２５℃の弾性率が、０．００１～１．５ＧＰａである。【選択図】なし