ADJUSTING METHOD OF MACHINING POINT POWER IN APERTURE MOUNTED ON PRINTED CIRCUIT BOARD LASER PROCESSING APPARATUS, AND PRINTED CIRCUIT BOARD LASER PROCESSING APPARATUS THAT IMPLEMENTS ADJUSTING METHOD OF MACHINING POINT POWER IN APERTURE MOUNTED ON PRINTED CIRCUIT BOARD LASER PROCESSING APPARATUS

To match processing point powers of both apertures by adjusting the zoom ratio of zoom according to a correction parameter based on a difference in processing point power between a case in which a standard aperture is used and a case in which a mounting aperture is used.SOLUTION: Apart from a standa...

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Bibliographische Detailangaben

Hauptverfasser:	NAMITA IZUMI, KANETANI YASUHIKO, KITA YASUHIKO, TATEISHI SHUSUKE
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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