MULTILAYER ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF THE SAME

To provide a multilayer electronic component.SOLUTION: A multilayer electronic component includes a body including a dielectric layer and an inner electrode, an electronic component body including an outer electrode disposed to the body, and a coating layer disposed on the outer surface of the elect...

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Hauptverfasser:	CHOI HYUNG JONG, PARK KYU SIK, LEE YOO JEONG, SON KWAN YOUNG, PARK MYUN-JUN, SUNG WOO KYUNG, WON KWANG YEUN
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ELECTRICITY
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Zusammenfassung:	To provide a multilayer electronic component.SOLUTION: A multilayer electronic component includes a body including a dielectric layer and an inner electrode, an electronic component body including an outer electrode disposed to the body, and a coating layer disposed on the outer surface of the electronic component body, containing one or more of silicon (Si) and fluorine (F), and including an average thickness of 5 nm or more and 15 nm or less.SELECTED DRAWING: Figure 3 【課題】積層型電子部品を提供する。【解決手段】本発明の一実施形態による積層型電子部品は、誘電体層及び内部電極を含む本体、及び上記本体に配置される外部電極を含む電子部品本体と、上記電子部品本体の外表面に配置され、シリコン（Ｓｉ）及びフッ素（Ｆ）のうち１つ以上を含み、平均厚さが５ｎｍ以上１５ｎｍ以下であるコーティング層と、を含む。【選択図】図３