MANUFACTURING METHOD OF PRINTED WIRING BOARD

To provide a manufacturing method for a printed wiring board that can efficiently manufacture a printed wiring board with a via hole and a trench.SOLUTION: A manufacturing method of a printed wiring board includes steps of (A) preparing a laminate sheet including a prepreg containing a sheet-shaped...

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Bibliographische Detailangaben
Hauptverfasser:	WATANABE MASATOSHI, OGURA ICHIRO, TSURUI KAZUHIKO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	To provide a manufacturing method for a printed wiring board that can efficiently manufacture a printed wiring board with a via hole and a trench.SOLUTION: A manufacturing method of a printed wiring board includes steps of (A) preparing a laminate sheet including a prepreg containing a sheet-shaped fiber base material and a first resin composition impregnated in the sheet-shaped fiber base material, and a resin composition layer provided on the prepreg and containing a second resin composition, (B) curing the prepreg and the resin composition layer to form a first insulating layer and a second insulating layer, (C) forming via holes in the first insulating layer and the second insulating layer by laser, and (D) forming a trench in the second insulating layer by performing wet sandblasting using abrasive grains.SELECTED DRAWING: Figure 4 【課題】ビアホール及びトレンチを有するプリント配線板を効率よく製造することができる、プリント配線板の製造方法の提供。【解決手段】（Ａ）シート状繊維基材、及び該シート状繊維基材に含浸された第１の樹脂組成物を含むプリプレグと、プリプレグ上に設けられ、第２の樹脂組成物を含む樹脂組成物層と、を有する積層シートを準備する工程、（Ｂ）プリプレグ及び樹脂組成物層を硬化して第１絶縁層及び第２絶縁層を形成する工程、（Ｃ）レーザーにより、第１絶縁層及び第２絶縁層にビアホールを形成する工程、及び（Ｄ）砥粒を用いるウェットサンドブラスト処理を行い、第２絶縁層にトレンチを形成する工程、を含む、プリント配線板の製造方法。【選択図】図４