ELECTRONIC COMPONENT MANUFACTURING DEVICE

To finely control the position and amount of a paste applied when the paste is applied to an electronic component element body.SOLUTION: A manufacturing device 100 of an electronic component includes a paste transfer body 30 that has a long surface to be coated 31 to which a paste 33 is applied, and a guided surface 32 on the back surface of the surface to be coated 31, and runs in the longitudinal direction, a plurality of guide members 40 that support the guided surface 32 of the paste transfer body 30 and determine the trajectory of the surface to be coated 31, a holding member 20 that holds an electronic component element body 11 in a manner in which the first main surface is exposed and conveys the electronic component body 11 in the same direction as the traveling direction of the paste transfer body 30, and a guide member control unit 50 that moves at least one of the plurality of guide members 40 in order to change at least one of the contact angle and the contact time when the first main surface of the electronic component body 11 comes into contact with the paste 33 applied to the surface to be coated 31 of the paste transfer body 30, and the separation angle when the first main surface is separated from the paste 33.SELECTED DRAWING: Figure 5 【課題】電子部品素体にペーストを塗布する際、ペーストの塗布位置や量を細かく制御する。【解決手段】電子部品の製造装置１００は、ペースト３３が塗布される長尺状の被塗布面３１、および、被塗布面３１の裏面に被ガイド面３２を有し、長手方向に走行するペースト転写体３０と、ペースト転写体３０の被ガイド面３２を支持し、被塗布面３１の軌道を定める複数のガイド部材４０と、第１の主面が露出する態様で電子部品素体１１を保持して、ペースト転写体３０の走行方向と同一方向に搬送する保持部材２０と、電子部品素体１１の第１の主面がペースト転写体３０の被塗布面３１に塗布されているペースト３３と接触する際の接触角度、接触時間、および、ペースト３３から離間する際の離間角度のうちの少なくとも１つを変更するために、複数のガイド部材４０のうちの少なくとも１つを移動させるガイド部材制御部５０とを備える。【選択図】図５