APPARATUS FOR TREATING SUBSTRATES

To provide a substrate treating apparatus for efficiency treating substrates.SOLUTION: The invention provides a substrate treating apparatus. The substrate treating apparatus comprises: a first step treating unit performing a batch liquid treatment on a plurality of substrates; and a second step tre...

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Bibliographische Detailangaben
Hauptverfasser:	CHANG KYU HWAN, CHOI JUN YOUNG
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	To provide a substrate treating apparatus for efficiency treating substrates.SOLUTION: The invention provides a substrate treating apparatus. The substrate treating apparatus comprises: a first step treating unit performing a batch liquid treatment on a plurality of substrates; and a second step treating unit treating the substrates which have been treated by the first step treating unit, and performing a one-by-one liquid treatment or drying treatment on each substrate.SELECTED DRAWING: Figure 1 【課題】基板を効率的に処理することができる基板処理装置を提供する。【解決手段】本発明は基板を処理する装置を提供する。基板処理装置は、バッチ式に複数の基板を液処理する第１工程処理部と、前記第１工程処理部で処理された基板を処理し、枚葉式に１つの基板を液処理又は乾燥処理する第２工程処理部と、を含むことができる。【選択図】図１