SUBSTRATE PROCESSING APPARATUS AND METHOD OF COUPLING SUPPORT UNIT

To provide a substrate processing apparatus.SOLUTION: In an example, a substrate processing apparatus includes: a process chamber including a first body and a second body which are combined with each other to form a processing space for processing a substrate therein; a driver which moves the proces...

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Bibliographische Detailangaben
Hauptverfasser: LEE SANG MIN, YOON DO HYEON
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To provide a substrate processing apparatus.SOLUTION: In an example, a substrate processing apparatus includes: a process chamber including a first body and a second body which are combined with each other to form a processing space for processing a substrate therein; a driver which moves the process chamber to an open position or a closed position; a support unit which supports a substrate within the processing space; and a fluid supply unit which supplies fluid to the processing space. The support unit may include: a support pin coupled to the first body or the second body; and a guide member which is coupled to the support pin and is extended in a lateral direction of the support pin to support the substrate.SELECTED DRAWING: Figure 3 【課題】本発明は、基板処理装置を提供する。【解決手段】一例で、基板処理装置は、お互いに組合されて内部に基板を処理する処理空間を有する第1ボディーと第2ボディーを有する工程チャンバと、工程チャンバを開放位置または閉鎖位置に移動させる駆動機と、処理空間内で基板を支持する支持ユニットと、処理空間に流体を供給する流体供給ユニットと、を含み、支持ユニットは、第1ボディーまたは第2ボディーに結合される支持ピンと、そして支持ピンに結合されて支持ピンの側方向に延長されて基板を支持するガイド部材と、を含むことができる。【選択図】図3