CURABLE COMPOSITION, AND ADHESIVE COMPOSITION, AND METHOD FOR PRODUCING CURABLE COMPOSITION

To provide a curable composition that has low viscosity and high workability, is quickly curable, and also excels in the mechanical properties of its cured product, adhesiveness to a substrate, and heat resistance, and provide an adhesive composition.SOLUTION: A curable composition has a (meth)acryl...

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1. Verfasser: MOCHIZUKI KATSUNOBU
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To provide a curable composition that has low viscosity and high workability, is quickly curable, and also excels in the mechanical properties of its cured product, adhesiveness to a substrate, and heat resistance, and provide an adhesive composition.SOLUTION: A curable composition has a (meth)acrylic polymer (A) having crosslinkable silyl groups, and an oxyalkylene polymer (B) having crosslinkable silyl group, wherein the (meth)acrylic polymer (A) has 1.5-3.0 crosslinkable silyl groups in one molecule, and the polymer has a viscosity at 25°C of 1,000-7,000 mPa s.SELECTED DRAWING: None 【課題】低粘度であり作業性に優れ、硬化速度が速く、且つ硬化物の機械的特性、基材との接着特性や耐熱性にも優れた硬化性組成物、及び、接着剤組成物を提供する。【解決手段】架橋性シリル基を有する(メタ)アクリル系重合体(A)、及び架橋性シリル基を有するオキシアルキレン系重合体(B)を含み、該(メタ)アクリル系重合体(A)は、架橋性シリル基を1分子中に1.5個~3.0個有するとともに、該重合体の25℃における粘度が1,000mPa・s~7,000mPa・sであることを特徴とする。【選択図】なし