SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

To realize a high performance semiconductor device which suppresses disconnection of a via wiring line provided in a substrate and a diamond layer that are bonded.SOLUTION: A semiconductor device 1A comprises: a substrate 10; and a diamond layer 30 that is bonded to the substrate. The substrate 10 h...

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Bibliographische Detailangaben
1. Verfasser:	MINOURA YUICHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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