MOLDING AND ELECTRONIC CIRCUIT BOARD

To provide a molding that has sufficiently improved dielectric properties as intended by the addition of liquid crystal polymer particles.SOLUTION: The inventive molding is formed from a thermosetting resin composition containing liquid crystal polymer particles and a thermosetting resin. Heating th...

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Bibliographische Detailangaben
Hauptverfasser:	AKIYAMA NOZOMI, EGASHIRA TOSHIAKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	To provide a molding that has sufficiently improved dielectric properties as intended by the addition of liquid crystal polymer particles.SOLUTION: The inventive molding is formed from a thermosetting resin composition containing liquid crystal polymer particles and a thermosetting resin. Heating the liquid crystal polymer particles at 190°C for 1 hour generates outgas with an acetic acid level of 10 ppm or less. The molding is in the shape of a film, sheet, or plate.SELECTED DRAWING: None 【課題】添加した液晶ポリマー粒子から予測される誘電特性の改善効果が十分に得られた成形体の提供。【解決手段】本発明による成形体は、液晶ポリマー粒子と、熱硬化性樹脂とを含む熱硬化性樹脂組成物から形成されるものであって、前記液晶ポリマー粒子を１９０℃で１時間の加熱処理した際に発生するアウトガスの酢酸量が１０ｐｐｍ以下であり、前記成形体が、フィルム状、シート状、または板状である。【選択図】なし