GRINDING DEVICE

To provide a grinding device that allows omission of a process of manually removing grinding chips sticking to an annular frame.SOLUTION: A grinding device includes: a chuck table for sucking and holding, via a protective tape, a workpiece stuck on an inner side relative to an inner peripheral edge...

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Bibliographische Detailangaben
1. Verfasser:	HOSHIKAWA HIROTOSHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CLEANING CLEANING IN GENERAL DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	To provide a grinding device that allows omission of a process of manually removing grinding chips sticking to an annular frame.SOLUTION: A grinding device includes: a chuck table for sucking and holding, via a protective tape, a workpiece stuck on an inner side relative to an inner peripheral edge of an opening part of a protective tape stuck on one surface of an annular frame so as to cover the opening part of an annular frame; a grinding unit having a grinding grindstone for grinding the workpiece held by the chuck table; and a frame washing unit for washing the other surface positioned on the opposite side of the one surface of the annular frame after grinding of the workpiece.SELECTED DRAWING: Figure 1 【課題】環状フレームに付着した研削屑を手作業で除去する工程を省略可能な研削装置を提供する。【解決手段】研削装置であって、環状フレームの開口部を覆う様に環状フレームの一面に貼り付けられた保護テープの開口部の内周縁よりも内側に貼り付けられた被加工物を、保護テープを介して吸引保持するチャックテーブルと、チャックテーブルで保持された被加工物を研削する研削砥石を有する研削ユニットと、被加工物の研削後における環状フレームの一面とは反対側に位置する他面を洗浄するフレーム洗浄ユニットと、を備える研削装置を提供する。【選択図】図１