LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE

To provide a light-emitting device which can suppress occurrence of defects by a metal member for joining when a light-emitting element is joined to a substrate, and a method for manufacturing the same.SOLUTION: A light-emitting device 10 includes a substrate 11 as a loading substrate, an element mounting part 13 that is arranged on the substrate 11 and is made of metal, and a light-emitting element 20 that has an element joint layer 24 made of metal, a support substrate 21 joined onto the upper surface of the element mounting part 13 through the element joint layer 24 and has a semiconductor layer including a semiconductor light-emitting layer formed on the support substrate 21, in which the light-emitting element 20 is joined so that the lower surface of the support substrate 21 is deviated in a direction 1 relative to the upper surface of the element mounting part 13, and the lower surface of the support substrate 21 projects in the direction 1 rather than the outer edge of the upper surface of the element mounting part 13 in top view.SELECTED DRAWING: Figure 1 【課題】発光素子を基板に接合する際に接合用の金属部材による不具合の発生を抑えることが可能な発光装置及びその製造方法を提供する。【解決手段】発光装置１０は、搭載基板としての基板１１と、基板１１上に配された金属からなる素子載置部１３と、金属からなる素子接合層２４を有し、素子載置部１３の上面上に素子接合層２４を介して接合された支持基板２１並びに支持基板２１上に形成された半導体発光層を含む半導体層を有する発光素子２０と、を含み、発光素子２０は、上面視において、支持基板２１の下面が前記素子載置部１３の上面に対して１の向きに偏倚しており、支持基板２１の下面が素子載置部１３の上面の外縁よりも１の向きに突出するように接合されている。【選択図】図１