RESIN SEALED ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF THE SAME

To provide a resin sealed electronic component having an electronic component body sealed by a resin housing including a sealing member composed of mold resin, and inhibiting the electronic component body from deforming or being damaged by melted mold resin, and a manufacturing method.SOLUTION: A detection unit 2 of a torque sensor 1 is sealed by a resin housing 3. The resin housing 3 comprises: first and second resin members 4, 5 radially arranged with a housing space 30 housing the detection unit 2 interposed therebetween; and a sealing member 6 including mold resin molded to cover at least part of each of the first and second resin members 4, 5. Part of the first resin member 4 and part of the second resin member 5 are aligned in an axial direction to form an inhibition structure for inhibiting the mold resin from entering the housing space 30.SELECTED DRAWING: Figure 6 【課題】モールド樹脂からなる封止部材を含む樹脂ハウジングによって電子部品本体を封止しながらも、溶融したモールド樹脂によって電子部品本体に変形や損傷等が発生してしまうことを抑制することが可能な樹脂封止型電子部品、及びその製造方法を提供する。【解決手段】トルクセンサ１は、検出部２が樹脂ハウジング３によって封止されている。樹脂ハウジング３は、検出部２を収容する収容空間３０を挟んで径方向に並ぶ第１及び第２の樹脂部材４，５と、第１及び第２の樹脂部材４，５のそれぞれの少なくとも一部を覆うように成形されたモールド樹脂からなる封止部材６とを備える。第１の樹脂部材４の一部と第２の樹脂部材５の一部とが軸方向に並び、モールド樹脂が収容空間３０に入り込むことを抑止する抑止構造を形成する。【選択図】図６