CONDUCTIVE ADHESIVE, ANISOTROPIC CONDUCTIVE FILM, CONNECTION STRUCTURE, AND MANUFACTURING METHOD FOR CONNECTION STRUCTURE

To provide a conductive adhesive that is able to satisfactory solder wettability and conductivity and to provide an anisotropic conductive film, a connection structure, and a method of manufacturing the connection structure, which can obtain satisfactory solder wettability, conductivity, and insulat...

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Bibliographische Detailangaben
Hauptverfasser:	SATO DAISUKE, AOKI KAZUHISA, KARAKIDA MITSUHIRO, OKUMIYA HIDEAKI, KUMAKURA HIROYUKI, MIYAUCHI KOICHI, HAYASHI NAOKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES ALLOYS BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CONDUCTORS CURRENT COLLECTORS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS INSULATORS LINE CONNECTORS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS USE OF MATERIALS AS ADHESIVES WELDING WORKING BY LASER BEAM
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