MANUFACTURING METHOD OF PACKAGING MATERIAL, PACKAGING MATERIAL, AND PACKAGING CONTAINER

To realize a structure with a simple configuration at low cost, where an arbitrary portion is intentionally made to be easily broken.SOLUTION: A manufacturing method of a packaging material comprises: a cutout forming step of forming one or more cutouts penetrating through a film-like or thin plate-...

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Bibliographische Detailangaben
Hauptverfasser: MORI YASUKI, MORI AKIHITO
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To realize a structure with a simple configuration at low cost, where an arbitrary portion is intentionally made to be easily broken.SOLUTION: A manufacturing method of a packaging material comprises: a cutout forming step of forming one or more cutouts penetrating through a film-like or thin plate-like substrate in a width direction thereof; and a cutout closing step of closing the cutouts by filling at least part of the cutouts with a thermal adhesive resin material.SELECTED DRAWING: Figure 1 【課題】任意の箇所を意図的に破壊し易くした構造を簡単な構成でかつ低コストで実現する。【解決手段】包装材の製造方法は、フィルム状又は薄板状の基材の厚み方向に貫いて1又は複数の切れ込み部を形成する切れ込み部形成工程と、切れ込み部の少なくとも一部を熱接着樹脂材で埋めることで切れ込み部を閉塞する切れ込み部閉塞工程と、を備える。【選択図】図1