FLAWED PIXEL PROCESSING METHOD OF IMAGING APPARATUS FOR COMPONENT MOUNTING APPARATUS, IMAGING APPARATUS FOR COMPONENT MOUNTING APPARATUS, AND COMPONENT MOUNTING APPARATUS

To provide a flawed pixel processing method of an imaging apparatus for a component mounting apparatus, the imaging apparatus for the component mounting apparatus, and the component mounting apparatus which make it possible to cope with a flawed pixel (a defective pixel) generated after delivery.SOL...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	NANBA TORU, OISHI TAKASHI, MICHIZOE AKIHIRO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PICTORIAL COMMUNICATION, e.g. TELEVISION PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	To provide a flawed pixel processing method of an imaging apparatus for a component mounting apparatus, the imaging apparatus for the component mounting apparatus, and the component mounting apparatus which make it possible to cope with a flawed pixel (a defective pixel) generated after delivery.SOLUTION: The flawed pixel processing method of the imaging apparatus for the component mounting apparatus, the imaging apparatus for the component mounting apparatus being a two-dimensional imaging apparatus provided in the component mounting apparatus for mounting a component on a board comprises a flawed pixel detection process S2 which, with a predetermined timing after the start of using the component mounting device, detects a flawed pixel generated after the start of using, in the imaging apparatus for the component mounting apparatus.SELECTED DRAWING: Figure 5 【課題】本発明は、出荷後に生じた傷画素（欠陥画素）の対処が可能となる部品実装装置用撮像装置の傷画素処理方法および部品実装装置用撮像装置ならびに部品実装装置を提供する。【解決手段】本発明の部品実装装置用撮像装置の傷画素処理方法は、部品を基板に実装する部品実装装置に備えられた２次元撮像装置である部品実装装置用撮像装置の傷画素処理方法であって、前記部品実装装置の使用開始後における所定のタイミングで、前記部品実装装置用撮像装置における、前記使用開始後に生じた傷画素を検出する傷画素検出工程Ｓ２を備える。【選択図】図５