SUBSTRATE-LESS SILICONE ADSORPTION SHEET, WAFER PROCESSING LAMINATE USING SHEET, AND WAFER PROCESSING METHOD USING PROCESSING LAMINATE

To provide a substrate-less silicone adsorption sheet that temporarily bonds a member to be processed such as grinding, and can be easily peeled off, and effectively obtain a thin film wafer at the time of manufacturing a semiconductor chip.SOLUTION: In a base substrate-less silicone adsorption shee...

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Bibliographische Detailangaben
Hauptverfasser:	SHINOZAKI FUMIAKI, SASAKI TOSHIKI, SUZUKI KYOICHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES SEMICONDUCTOR DEVICES TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	To provide a substrate-less silicone adsorption sheet that temporarily bonds a member to be processed such as grinding, and can be easily peeled off, and effectively obtain a thin film wafer at the time of manufacturing a semiconductor chip.SOLUTION: In a base substrate-less silicone adsorption sheet composed of a first release film, a first silicone adsorption layer A, a second silicone adsorption layer B, and a second release film, the peeling force of each of the adsorption layers is 5 to 60 mN/25 mm for the first silicone adsorption layer A and 100 mN or more for the second silicone adsorption layer B for a glass substrate with a surface roughness Ra of 0.08 μm. In a wafer processing laminate, a temporary support and a bonding layer surface formed so as to cover the unevenness of a circuit-formed wafer surface are laminated with this substrate-less silicone adsorption sheet interposed therebetween.SELECTED DRAWING: Figure 1 【課題】研削等の加工を行う部材と仮支持体との仮接着、剥離が容易な基材レスシリコーン吸着シートの提供および半導体チップの製造時に薄膜ウェーハを効果的に得ることを可能にする。【解決手段】第１の離型フィルム／第１のシリコーン吸着層Ａ／第２のシリコーン吸着層Ｂ／第２の離型フィルムの構成よりなる基材レスシリコーン吸着シートであり、各吸着層の剥離力は、表面粗さＲａが０．０８μｍのガラス基板に対して、第１のシリコーン吸着層Ａが５～６０ｍＮ／２５ｍｍ、第２のシリコーン吸着層Ｂが１００ｍＮ以上である基材レスシリコーン吸着シート。この基材レスシリコーン吸着シートを介在させて、仮支持体と回路形成されたウェーハ表面の凹凸を覆うように形成した接合層面とを積層したウェーハ加工用積層体とする。【選択図】図１