(METH)ACRYLATE RESIN, CURABLE RESIN COMPOSITION, CURED PRODUCT, AND ARTICLE
To provide a (meth)acrylate resin capable of forming a cured product having excellent elongation and dielectric characteristics, a curable resin composition containing the (meth)acrylate resin, a cured product of the curable resin composition, and an article.SOLUTION: The (meth)acrylate resin contai...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | To provide a (meth)acrylate resin capable of forming a cured product having excellent elongation and dielectric characteristics, a curable resin composition containing the (meth)acrylate resin, a cured product of the curable resin composition, and an article.SOLUTION: The (meth)acrylate resin contains an epoxy resin (A) and an unsaturated monobasic acid (B) as essential raw materials. The epoxy resin (A) contains a compound (a1) having a phenolic hydroxyl group, an aromatic compound (a2) having at least two ethylenically unsaturated bonds, and an epihalohydrin (a3) as essential raw materials.SELECTED DRAWING: None
【課題】優れた伸度及び誘電特性を有する硬化物を形成可能な(メタ)アクリレート樹脂、これを含有する硬化性樹脂組成物、前記硬化性樹脂組成物の硬化物及び物品を提供する。【解決手段】エポキシ樹脂(A)と、不飽和一塩基酸(B)と、を必須原料とする(メタ)アクリレート樹脂であって、前記エポキシ樹脂(A)が、フェノール性水酸基を有する化合物(a1)、エチレン性不飽和結合を少なくとも2つ有する芳香族化合物(a2)及びエピハロヒドリン(a3)を必須原料とするものであることを特徴とする(メタ)アクリレート樹脂を用いる。【選択図】なし |
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