WIRE TREATING SYSTEM AND WIRE TREATING METHOD

To automatically and accurately remove a joined part of wires to be treated.SOLUTION: A delivery part 110 delivers a wire to be treated obtained by joining a plurality of wires. A wire treating part 130 subjects the wire to be treated delivered by the delivery part 110 to wire treatment including an...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MURAYAMA KATSUHIKO, FUJIWARA FUMIAKI
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To automatically and accurately remove a joined part of wires to be treated.SOLUTION: A delivery part 110 delivers a wire to be treated obtained by joining a plurality of wires. A wire treating part 130 subjects the wire to be treated delivered by the delivery part 110 to wire treatment including any one of heat treatment and molding. A storage part 150 stores the wire to be treated subjected to the wire treatment by the wire treating part 130. A joined part detection part 120 detects passage of a joined part of the wires in the wires to be treated delivered by the delivery part 110. A cutting part 140 cuts the wire to be treated based on a detection result of passage of the joined part by the joined part detection part 140 between the wire treating part 130 and the storage part 150, and thereby removes the joined part in the wire to be treated.SELECTED DRAWING: Figure 1 【課題】被処理線材の接合部を自動的に精度よく除去すること。【解決手段】繰り出し部110は、複数本の線材を接合してなる被処理線材を繰り出す。線材処理部130は、繰り出し部110によって繰り出された被処理線材に対して、熱処理及び成形の少なくともいずれかを含む線材処理を行う。収容部150は、線材処理部130によって線材処理が行われた被処理線材を収容する。接合部検出部120は、繰り出し部110によって繰り出された被処理線材における線材の接合部の通過を検出する。切断部140は、線材処理部130と収容部150との間において、接合部検出部140による接合部の通過の検出結果に基づいて被処理線材を切断することにより、被処理線材における接合部を除去する。【選択図】図1