TOP RING AND SUBSTRATE TREATMENT APPARATUS

To realize a top ring which can uniformly press a substrate against an abrasive pad, and is compact.SOLUTION: A top ring 302 for holding a substrate WF includes: a base member 301 connected to a rotary shaft 18 to hold a substrate WF; a substrate adsorption member 330 including a porous member 334 h...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KASHIWAGI MAKOTO, FURUSAWA MANATO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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