TOP RING AND SUBSTRATE TREATMENT APPARATUS

To realize a top ring which can uniformly press a substrate against an abrasive pad, and is compact.SOLUTION: A top ring 302 for holding a substrate WF includes: a base member 301 connected to a rotary shaft 18 to hold a substrate WF; a substrate adsorption member 330 including a porous member 334 having a substrate adsorption face 334a for adsorbing the substrate WF and a pressure reduction part 334b communicating with pressure reduction means 31, a shield member 332 which is so configured as to shield a face 334c of the porous member 334 opposite to the substrate adsorption face 334a and a lateral face 334d, and a frame member 344 which is so provided on the shield member 332 as to surround at least a part of a circumference of the base member 301; and an elastic member 340 which connects at least a part surrounded by the frame member 344 of the base member 301 and the frame member 344.SELECTED DRAWING: Figure 3 【課題】基板を研磨パッドに均一に押圧することができ、かつコンパクトなトップリングを実現する【解決手段】本実施形態のトップリング３０２は、基板ＷＦを保持するためのものであり、回転シャフト１８に連結されたベース部材３０１と、基板ＷＦを吸着するための基板吸着面３３４ａおよび減圧手段３１と連通する減圧部３３４ｂを有する多孔質部材３３４、多孔質部材３３４の基板吸着面３３４ａとは反対側の面３３４ｃおよび側面３３４ｄを遮蔽するように構成された遮蔽部材３３２、およびベース部材３０１の少なくとも一部の周囲を囲むように遮蔽部材３３２に設けられた枠部材３４４、を含む基板吸着部材３３０と、ベース部材３０１の枠部材３４４に囲まれた少なくとも一部と枠部材３４４とを接続する弾性部材３４０と、を含む。【選択図】図３