SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND POWER CONVERSION DEVICE

To provide a semiconductor device that can be reduced in size, and a manufacturing method for a semiconductor device.SOLUTION: An inner lead 3e having die pads 3a and 3b having semiconductor elements 1a and 1b on upper surfaces has a stepped shape. A surface of a part of the inner lead 3e is exposed...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	ICHIKAWA KEITARO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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