SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND POWER CONVERSION DEVICE

To provide a semiconductor device that can be reduced in size, and a manufacturing method for a semiconductor device.SOLUTION: An inner lead 3e having die pads 3a and 3b having semiconductor elements 1a and 1b on upper surfaces has a stepped shape. A surface of a part of the inner lead 3e is exposed...

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Bibliographische Detailangaben
1. Verfasser:	ICHIKAWA KEITARO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	To provide a semiconductor device that can be reduced in size, and a manufacturing method for a semiconductor device.SOLUTION: An inner lead 3e having die pads 3a and 3b having semiconductor elements 1a and 1b on upper surfaces has a stepped shape. A surface of a part of the inner lead 3e is exposed from sealing resin 5 in a plan view. An outer lead 3f connected to and continuing to the inner lead 3e has a first bending part 3g on a side surface of the sealing resin 5 so as to extend to a direction of the upper surface of the die pad 3a. Thus, a semiconductor device with the reduced size can be obtained.SELECTED DRAWING: Figure 2 【課題】小型化可能な半導体装置及び半導体装置の製造方法を提供する。【解決手段】半導体素子１ａ、１ｂを上面に搭載するダイパッド３ａ、３ｂを有するインナーリード３ｅは、段差形状を有し、平面視にてインナーリード３ｅの一部の面が、封止樹脂５から露出している。インナーリード３ｅと繋がって連結されたアウターリード３ｆは、ダイパッド３ａの上面の方向に延在するように、封止樹脂５の側面に第１の屈曲部３ｇを有することにより、小型化された半導体装置を得ることができる。【選択図】図２