POWER SUPPLY APPARATUS

To provide a power supply apparatus 31 capable of enhancing the power density of a substrate S to be treated to increase power efficiency when sequentially treating a plurality of substrates S in surface treatment performed to the substrates S having applied voltage, and a surface treatment machine...

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Bibliographische Detailangaben
Hauptverfasser:	AOYAMA TAKAAKI, DAIKO YOSHINORI, MIYAUCHI MITSUSUKE
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTINGELECTRIC POWER COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CONVERSION OR DISTRIBUTION OF ELECTRIC POWER DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRICITY GENERATION INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION SYSTEMS FOR STORING ELECTRIC ENERGY
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Beschreibung
Zusammenfassung:	To provide a power supply apparatus 31 capable of enhancing the power density of a substrate S to be treated to increase power efficiency when sequentially treating a plurality of substrates S in surface treatment performed to the substrates S having applied voltage, and a surface treatment machine 1 using the same.SOLUTION: A power supply apparatus 31 used for a surface treatment machine 1 for sequentially subjecting a plurality of substrates S to surface treatment and attached to a rotor 22 for supplying electric power to the substrates S supplies electric power supplied from a power supply 32 to the substrates S held on the rotor 22 and selectively switches power supply and non-power supply by the rotation angle of the rotor 22.SELECTED DRAWING: Figure 1 【課題】電圧を印加した基板Ｓに対して行う表面処理において、複数の基板Ｓを順次処理をする場合に、処理される基板Ｓの電力密度を高め、電力効率を上げることができる給電装置３１、及びこれを用いた表面処理機１を提供する。【解決手段】複数の基板Ｓに順次表面処理をする表面処理機１に用いられる給電装置３１であって、基板Ｓに電力を供給する回転体２２に取り付けられ、電源３２から供給される電力を回転体２２に保持された基板Ｓに供給し、回転体２２の回転角度によって、給電と非給電とを選択的に切り替える。【選択図】図１