PHENOL RESIN MOLDING AND METHOD FOR PRODUCING THE SAME

To provide a phenol resin molding having high heat insulation performance and excellent heat resistance (contraction suppression under high temperature and high humidity), and a method for producing the same.SOLUTION: A phenol resin molding has a surface having a surface void ratio of 3% or more and...

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Hauptverfasser:	MAEJIMA KOJI, MITSUBORI HISASHI, CHIKADA MASASHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Zusammenfassung:	To provide a phenol resin molding having high heat insulation performance and excellent heat resistance (contraction suppression under high temperature and high humidity), and a method for producing the same.SOLUTION: A phenol resin molding has a surface having a surface void ratio of 3% or more and 20% or less, and a density of 300 kg/m3 or more and 1,100 kg/m3 or less. A method for producing a phenol resin molding includes a step of hot press molding phenol foam powder having a volume average particle diameter of 20 μm or more and 550 μm or less, a bulk density of 5 kg/m3 or more and 150 kg/m3 or less.SELECTED DRAWING: Figure 1 【課題】本発明は、高い断熱性能と優れた耐熱性（高温、高湿度下での収縮抑制）とを有する、フェノール樹脂成形体、及び、その製造方法を提供する。【解決手段】表面空隙率が３％以上２０％以下である面を有し、密度が３００ｋｇ／ｍ３以上１，１００ｋｇ／ｍ３以下である、フェノール樹脂成形体。更には、体積平均粒径が２０μｍ以上５５０μｍ以下であり、嵩密度が５ｋｇ／ｍ３以上１５０ｋｇ／ｍ３以下であるフェノールフォーム粉を熱プレス成形する工程を含む、フェノール樹脂成形体の製造方法。【選択図】図１