SEMICONDUCTOR DEVICE
To provide a semiconductor device that can accurately measure a case temperature.SOLUTION: A semiconductor device includes a semiconductor element, a base plate, a temperature monitor unit, and a heat conductive material. The base plate holds the semiconductor element on the upper surface and includ...
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| Sprache: | eng ; jpn |
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| Zusammenfassung: | To provide a semiconductor device that can accurately measure a case temperature.SOLUTION: A semiconductor device includes a semiconductor element, a base plate, a temperature monitor unit, and a heat conductive material. The base plate holds the semiconductor element on the upper surface and includes a hole on the lower surface. The temperature monitor unit includes a temperature detection unit mounted inside the hole and a wiring derived from the temperature detection unit. The heat conductive material is provided with a pattern on the lower surface of the base plate. The pattern of the heat conductive material includes a groove extending from the hole to the end of the base plate. The wiring of the temperature monitor unit is provided in the groove.SELECTED DRAWING: Figure 1
【課題】ケース温度を正確に測定することが可能な半導体装置を提供する。【解決手段】半導体装置は、半導体素子、ベース板、温度モニタ部および熱伝導材を含む。ベース板は、上面に半導体素子を保持し、下面に穴を含む。温度モニタ部は、穴の内部に取り付けられる温度検出部と、温度検出部から導出される配線と、を含む。熱伝導材は、ベース板の下面にパターンを有して設けられる。熱伝導材のパターンは、穴からベース板の端部まで延在する溝を含む。温度モニタ部の配線は、溝に設けられている。【選択図】図１ |
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