SCRIBING WHEEL FOR BRITTLE MATERIAL SUBSTRATE AND METHOD FOR PRODUCING THE SAME

To provide a scribing wheel for a brittle material substrate capable of reducing or suppressing the generation of micro-cracks in a horizontal direction and, particularly, increasing the cutting performance of a brittle material substrate with a thickness of 0.1 mm or less, and a method for producing the same.SOLUTION: This invention relates to a disk-shaped scribing wheel for forming a scribing line in a brittle material substrate. The scribing wheel 1 alternately comprises first blades 10 and second blades 20 at an outer circumferential part 3 thereof in a circumferential direction. The outer circumferential part 3 comprises: a pair of flanks 3a making the first blades 10 crossing each other forming a V-shape; and recessed parts 22 recessed from either or both of the pair of flanks 3a to form the second blades 20. In this invention, a difference s in a radial direction between positions of the blade edges 11 of the first blades 10 and the positions of the blade edges 21 of the second blades 20 is below 0.5 μm.SELECTED DRAWING: Figure 1 【課題】水平方向へのマイクロクラックの発生を低減又は抑制でき、特に厚さが０．１ｍｍ以下の脆性材料基板の切断性能を高めることができる脆性材料基板用のスクライビングホイール及びその製造方法を提供する。【解決手段】本発明は、脆性材料基板にスクライブラインを付すためのディスク状のスクライビングホイールに係る。スクライビングホイール１は、その外周部３に第１の刃１０と第２の刃２０とを円周方向交互に備える。外周部３は、Ｖ字状に交差して第１の刃１０をなす一対の斜面３ａと、一対の斜面３ａの一方又は両方から窪んで第２の刃２０をなす凹部２２とを含む。本発明において、第１の刃１０の刃先１１の位置と第２の刃２０の刃先２１の位置との半径方向における差Ｓは０．５μｍ未満である。【選択図】図１