LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF

To provide a chip LED type light-emitting device and a manufacturing method thereof that suppress mounting defects when mounted on a mounting board.SOLUTION: A light-emitting device 100 includes an insulating substrate 11 having a first notch 12 and a second notch 13, a first wiring 21 formed so as to close the upper end portion of the first notch on the upper surface of the substrate, a second wiring 22 that is separated from the first wiring and is formed so as to close the upper end portion of the second notch on the upper surface of the substrate, a second electrode 24 formed on the lower surface of the substrate, and a light emitting element arranged on the substrate such that power can be supplied by the first wiring and the second wiring, and each of the first notch and the second notch has an upwardly constricted shape.SELECTED DRAWING: Figure 1 【課題】実装基板への実装時に実装不良を抑えるチップＬＥＤ型の発光装置及びその製造方法を提供する。【解決手段】発光装置１００は、第１の切欠き１２及び第２の切欠き１３をそれぞれ有する絶縁性の基板１１と、前記基板の上面において前記第１の切欠きの上端部を塞ぐように形成された第１の配線２１と、前記第１の配線とは離間しておりかつ前記基板の上面において前記第２の切欠きの上端部を塞ぐように形成された第２の配線２２と、前記基板の下面に形成された第２の電極２４と、前記第１の配線及び前記第２の配線によって給電可能に前記基板上に配された発光素子と、を含み、前記第１の切欠き及び前記第２の切欠きの各々は、上方に向かって窄んだ形状を有している。【選択図】図１