LASER PROCESSING DEVICE AND LASER PROCESSING METHOD

To provide a laser processing device and a laser processing method which can accurately calculate amounts of positional shift of a position at which a chip is mounted on a substrate.SOLUTION: A laser processing device comprises a laser oscillator, a first mirror, a measurement beam deflection unit, a lens, a control part, a measurement processing part, and a beam position measurement unit. Processing data include a first indicated value indicating an operation amount of the first mirror and a second indicated value indicating an operation amount of the measurement beam deflection unit. The beam position measurement unit has a position measurement mirror that reflects a laser beam for processing and a measurement beam passing through the lens and a two-dimensional photographing element that measures positions of the laser beam for processing and the measurement beam reflected on the position measurement mirror.SELECTED DRAWING: Figure 3 【課題】チップの基板への実装位置のズレ量を精度良く算出できるレーザ加工装置及びレーザ加工方法の提供に資する。【解決手段】レーザ加工装置は、レーザ発振器と、第１ミラーと、測定光偏向ユニットと、レンズと、制御部と、計測処理部と、ビーム位置測定ユニットと、を有し、加工データは、第１ミラーの動作量を示す第１指示値と、測定光偏向ユニットの動作量を示す第２指示値と、を含み、ビーム位置測定ユニットは、レンズを通った加工用レーザ光及び測定光を反射する位置測定ミラーと、位置測定ミラーで反射した加工用レーザ光及び測定光の位置を測定する２次元撮像素子とを有する。【選択図】図３