RESIN MOLDING DEVICE AND MANUFACTURING METHOD OF RESIN MOLDING

To provide a resin molding device capable of suppressing the occurrence of defects related to resin filling.SOLUTION: A resin molding device includes: a mold that forms a cavity; a pot that is provided in the mold, can accommodate a resin material, and has an opening directly open to the cavity; and...

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Bibliographische Detailangaben
Hauptverfasser:	YASUI HAYATO, ONISHI YOHEI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	To provide a resin molding device capable of suppressing the occurrence of defects related to resin filling.SOLUTION: A resin molding device includes: a mold that forms a cavity; a pot that is provided in the mold, can accommodate a resin material, and has an opening directly open to the cavity; and a plunger that is provided so as to be slidable in the pot, and pushes out the resin material accommodated in the pot to transfer the resin material toward the cavity through the opening, wherein an inner diameter of the opening is formed to be the same as an outer diameter of the plunger or larger than the outer diameter of the plunger.SELECTED DRAWING: Figure 7 【課題】樹脂充填に関する不具合の発生を抑制することが可能な樹脂成形装置を提供する。【解決手段】キャビティを形成する成形型と、前記成形型に設けられ、樹脂材料を収容可能であり、前記キャビティに対して直接的に開口する開口部が形成されたポットと、前記ポット内を摺動可能となるように設けられ、前記ポットに収容された樹脂材料を押し出すことにより、前記開口部を介して樹脂材料を前記キャビティに向けて移送するプランジャと、を具備し、前記開口部の内径は、前記プランジャの外径と同一、又は前記プランジャの外径よりも大きく形成されている。【選択図】図７