SUBSTRATE TREATMENT METHOD, SUBSTRATE TREATMENT DEVICE AND SUBSTRATE TREATMENT SYSTEM

To provide improved etching resistance and reduce surface roughness of a metal-containing resist pattern formed on the surface of a substrate.SOLUTION: A substrate treatment method includes the step in which: the inside of a treatment vessel for accommodating a substrate with a metal-containing resi...

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Bibliographische Detailangaben
Hauptverfasser:	KIKAI TAKAYA, IDE HIROYUKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	To provide improved etching resistance and reduce surface roughness of a metal-containing resist pattern formed on the surface of a substrate.SOLUTION: A substrate treatment method includes the step in which: the inside of a treatment vessel for accommodating a substrate with a metal-containing resist pattern formed on the surface is put into a hypoxic atmosphere, and the resist pattern is to be irradiated with vacuum ultraviolet light.SELECTED DRAWING: Figure 2 【課題】基板の表面に形成された金属を含有するレジストパターンについて、エッチング耐性を高くすると共に、表面の荒れを低減させること【解決手段】金属を含有するレジストパターンが表面に形成された基板を格納する処理容器内の雰囲気を低酸素雰囲気とした状態で、当該レジストパターンに真空紫外光を照射する工程を行う。【選択図】図２