SEMICONDUCTOR DEVICE

To provide a suitable semiconductor device even in the case of using a SiC substrate for a semiconductor chip.SOLUTION: A semiconductor device comprises: a semiconductor chip 30 with an element formed on a SiC substrate; a pair of heat sinks 40 and 50, making heat dissipation members and disposed so...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	INABA YUKI, YAMAGISHI TETSUTO, YOSHIKAWA HIROKI, SAKAMOTO ZENJI, KAIZU RYOICHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!