CONDUCTIVE ADHESIVE COMPOSITION
To provide a conductive adhesive composition containing a conductive powder and a curable component, capable of achieving good adhesive strength.SOLUTION: The conductive adhesive composition contains (A) a conductive powder and (B) a curable component. The content of the curable component (B) is 20...
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Zusammenfassung: | To provide a conductive adhesive composition containing a conductive powder and a curable component, capable of achieving good adhesive strength.SOLUTION: The conductive adhesive composition contains (A) a conductive powder and (B) a curable component. The content of the curable component (B) is 20 pts.mass or more based on 100 pts.mass of the conductive powder (A). The conductive adhesive composition further contains (C) a phosphoric acid-containing curable component having general formula (1): CH2=C(X)-C(=O)-O-CH2CH2-O-P(=O)(OH)2 (provided that X in the formula (1) is a hydrogen atom (H) or a methyl group (CH3)) and having a molecular weight within the range of 150-1,000. The content of the phosphoric acid-containing curable component (C) is 0.01 pt.mass or more and 5 pts.mass or less based on 100 pts.mass of the total amount of the conductive powder (A) and the curable component (B).SELECTED DRAWING: None
【課題】良好な接着強度を実現可能とする、導電性粉末および硬化性成分を含有する導電性接着剤組成物の提供。【解決手段】(A)導電性粉末および(B)硬化性成分を含有し、前記(A)導電性粉末を100質量部としたときに前記(B)硬化性成分の含有量が20質量部以上であり、さらに、下記式(1)の一般式を有し、分子量が150~1000の範囲内である(C)リン酸含有硬化性成分を含有し、式(1)CH2=C(X)-C(=O)-O-CH2CH2-O-P(=O)(OH)2(ただし、式(1)におけるXは、水素原子(H)またはメチル基(CH3)である。)前記(A)導電性粉末および前記(B)硬化性成分の合計量を100質量部としたときに、前記(C)リン酸含有硬化性成分の含有量が0.01質量部以上5質量部以下であることを特徴とする、導電性接着剤組成物。【選択図】なし |
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