COMPONENT MOUNTING DEVICE AND METHOD OF MANUFACTURING COMPONENT MOUNTING SUBSTRATE USING THE SAME

To provide a component mounting device and a method of manufacturing a component mounting substrate using the same, capable of mounting components at precise positions on a substrate.SOLUTION: A component mounting device for mounting components on a substrate comprises: a component holding unit that holds a component; a substrate stage on which the substrate is placed and that incorporates heating means; a first imaging unit that captures an image of the component held by the component holding unit or the substrate placed on the substrate stage; a first temperature detection unit that detects a temperature of the first imaging unit; and a control unit. The control unit has: a first recognition unit that recognizes a position of the component or the substrate on the basis of a captured image of the first imaging unit; and a first correction unit that corrects the recognition result of the first recognition unit on the basis of the detection result of the first temperature detection unit and first information on a relation between the detection temperature of the first temperature detection unit and a recognition shift of the first recognition unit.SELECTED DRAWING: Figure 1 【課題】部品を基板に対してより正確な位置に実装することができる部品実装装置およびそれを用いた部品実装基板の製造方法を提供すること。【解決手段】部品を基板に実装する部品実装装置は、部品を保持する部品保持部と、基板が載置され、加熱手段を内蔵した基板ステージと、部品保持部によって保持された部品又は基板ステージに載置された基板を撮像する第１撮像部と、第１撮像部の温度を検出する第１温度検出部と、制御部と、を備え、制御部は、第１撮像部の撮像画像に基づいて部品又は基板の位置を認識する第１認識部と、第１温度検出部の検出温度と第１認識部の認識ずれとの関係に関する第１情報と第１温度検出部の検出結果とに基づいて、第１認識部の認識結果を補正する第１補正部とを有する。【選択図】図１