METHOD OF MANUFACTURING ELECTRONIC COMPONENT

To provide a method of manufacturing an electronic component capable of removing foreign matters adhered onto lateral faces of laminate chips.SOLUTION: A method of manufacturing an electronic component 10 includes: a laminate chip arrangement step S1 of arranging at a predetermined interval a plural...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	MIZUKAMI MIYUKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ELECTRICITY
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