METHOD OF MANUFACTURING ELECTRONIC COMPONENT

To provide a method of manufacturing an electronic component capable of removing foreign matters adhered onto lateral faces of laminate chips.SOLUTION: A method of manufacturing an electronic component 10 includes: a laminate chip arrangement step S1 of arranging at a predetermined interval a plurality of laminate chips 22 in each of which dielectric layers 13 and internal electrode layers 14 are laminated, an end part of each internal electrode layer 14 being exposed from a lateral face 22c; and a cleaning step S41, S45 of cleaning the lateral faces 22c of the laminate chips 22 by spraying mixed fluid in which cleaning liquid is made to be mist by being mixed with compressed air.SELECTED DRAWING: Figure 19 【課題】積層体チップの側面に付着した異物を除去可能な電子部品の製造方法を提供する。【解決手段】本発明の電子部品１０の製造方法は、内部電極層１４と誘電体層１３との積層体であって、側面２２ｃから前記内部電極層１４の端部が露出している複数の積層体チップ２２を、所定間隔で配置する積層体チップ配置工程Ｓ１と、前記積層体チップ２２の前記側面２２ｃに対して、圧縮空気と洗浄液とが混合されて前記洗浄液が霧状となった混合流体を噴射して洗浄する洗浄工程Ｓ４１，Ｓ４５と、を含む。【選択図】図１９