METHOD AND DEVICE FOR EVALUATING JOINT LAYER

To solve an issue that there is no quantitatively evaluating a joint layer.SOLUTION: In an SiC substrate 106, a thin film heater 117a, b made of Ni-P is formed between a terminal electrode 115a and a terminal electrode 115b, a temperature probe 116 made of Ni-P is formed between a terminal electrode...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OYA REIJI, TAKAHARA HIROSHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS TESTING
Online-Zugang:	Volltext bestellen
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