IMAGING MODULE

To provide an imaging module that can easily identify the top and bottom of an imaging element.SOLUTION: An imaging module consists of an imaging element having a light receiving surface, an electrode surface located on the opposite side of the light receiving surface, and a plurality of imaging ele...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: OSE KOJI, NUMAZAWA YOSHINOBU, OISHI WATARU
Format: Patent
Sprache:eng ; jpn
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:To provide an imaging module that can easily identify the top and bottom of an imaging element.SOLUTION: An imaging module consists of an imaging element having a light receiving surface, an electrode surface located on the opposite side of the light receiving surface, and a plurality of imaging element electrodes formed on the electrode surface, a substrate having a first surface, a second surface located on the opposite side of the first surface, and a first end surface facing the electrode surface, a cable section having conductors electrically connected to the imaging element electrode via wiring on the substrate, an encapsulating resin covering at least the first surface and the second surface, and a discriminating resin attached to a portion of the encapsulating resin that is located on the first surface or on the second surface.SELECTED DRAWING: Figure 3 【課題】撮像素子の上下を容易に識別することが可能な撮像モジュールを提供する。【解決手段】撮像モジュールは、受光面と、前記受光面とは反対側に位置する電極面と、前記電極面上に形成された複数の撮像素子電極とを有する撮像素子と、第1面と、前記第1面とは反対側に位置する第2面と、前記電極面に対向する第1端面とを有する基板と、前記基板上の配線を介して前記撮像素子電極と電気的に接続される導体を有するケーブル部と、前記第1面および前記第2面を少なくとも覆う封止樹脂と、前記封止樹脂のうち、前記第1面上に位置する部分または前記第2面上に位置する部分に付着した識別樹脂と、を備える。【選択図】図3