STAMP TOOL AND MANUFACTURING METHOD OF ELEMENT ARRAY

To provide a stamp tool that makes it easy to share a transport head and a manufacturing method of an element array that uses the stamp tool.SOLUTION: A stamp tool 10 includes: a stamp layer 12 to which an element 32r as a transport target element can be detachably adhered; a support plate 14 to whi...

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Bibliographische Detailangaben
Hauptverfasser:	MIYAKOSHI TOSHINOBU, KATO YASUO, YAMASHITA MAKOTO, SUNAGA SEIJURO, OTOMO TATSUNORI, SATO YOHEI, MAKITA KOETSU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	To provide a stamp tool that makes it easy to share a transport head and a manufacturing method of an element array that uses the stamp tool.SOLUTION: A stamp tool 10 includes: a stamp layer 12 to which an element 32r as a transport target element can be detachably adhered; a support plate 14 to which the stamp layer 12 is fixed; and an adapter plate 16 having a mounting surface 16a to which the support plate 14 can be replaceably attached and a transport head 22 can be detachably attached.SELECTED DRAWING: Figure 1A 【課題】搬送ヘッドの共用化が容易であるスタンプツールと、それを用いた素子アレイの製造方法とを提供すること。【解決手段】スタンプツール１０が、搬送対象要素としての素子３２ｒを着脱自在に粘着可能なスタンプ層１２と、スタンプ層１２が固定される支持板１４と、支持板１４が交換自在に取り付けられ、搬送ヘッド２２が着脱自在に装着可能な取付面１６ａを持つアダプタ板１６と、を有する。【選択図】図１Ａ