SEMICONDUCTOR DEVICE

To provide a technology that can suppress the application of spike voltage to semiconductor components.SOLUTION: A semiconductor device may have a first substrate, a second substrate facing the first substrate with a gap between the first substrate and the second substrate, a semiconductor component...

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Bibliographische Detailangaben
Hauptverfasser:	INOUE DAISUKE, IWAKI TOSHIAKI, WAKAMATSU KEISUKE
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	To provide a technology that can suppress the application of spike voltage to semiconductor components.SOLUTION: A semiconductor device may have a first substrate, a second substrate facing the first substrate with a gap between the first substrate and the second substrate, a semiconductor component disposed between the first substrate and the second substrate and attached to the first substrate, a capacitor disposed on the opposite side of the semiconductor component via the second substrate and attached to the second substrate, and a connection wiring that electrically connects the input terminal of the semiconductor component to the capacitor.SELECTED DRAWING: Figure 3 【課題】半導体部品にスパイク電圧が印加されることを抑制することができる技術を提供する。【解決手段】半導体装置は、第１基板と、第１基板と隙間を有して対向している第２基板と、第１基板と第２基板との間に配置されており、第１基板に取り付けられている半導体部品と、第２基板を介して半導体部品と反対側に配置されており、第２基板に取り付けられているキャパシタと、半導体部品の入力端子とキャパシタとを電気的に接続する接続配線と、を備えていてもよい。【選択図】図３