RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE

To provide a radio-frequency module that have a simplified manufacturing process and that have a reduced size.SOLUTION: A radio-frequency module 1 includes a module substrate 91 having principal surfaces 91a and 91b opposite to each other, and a first circuit component and a second circuit component. In a plan view of the principal surface 91b, the module substrate 91 includes: a recessed region 91R in which a principal surface 91c that is recessed toward the principal surface 91a from the principal surface 91b is a bottom surface; and a protruding region 91S located on an outer periphery of the recessed region 91R. A via conductor 95v is disposed in the protruding region 91S, the via conductor 95v extending in a direction perpendicular to the principal surface 91b and having an end exposed on the principal surface 91b. The first circuit component is disposed on the principal surface 91a, and the second circuit component is disposed on the principal surface 91c of the recessed region 91R.SELECTED DRAWING: Figure 2B 【課題】製造工程が簡素化された小型の高周波モジュールを提供する。【解決手段】高周波モジュール１は、互いに対向する主面９１ａおよび９１ｂを有するモジュール基板９１と、第１回路部品および第２回路部品と、を備え、主面９１ｂを平面視した場合、モジュール基板９１は、主面９１ｂから主面９１ａ側へ後退した主面９１ｃを底面とする凹部領域９１Ｒと、凹部領域９１Ｒの外周に位置する凸部領域９１Ｓと、を含み、凸部領域９１Ｓには、主面９１ｂの垂直方向に延び、一端が主面９１ｂに露出したビア導体９５ｖが配置されており、主面９１ａには第１回路部品が配置されており、凹部領域９１Ｒの主面９１ｃ上には第２回路部品が配置されている。【選択図】図２Ｂ