COMPOSITION, METHOD OF FORMING SILVER SINTERED MATERIAL, JOINING METHOD, ARTICLE AND METHOD OF MANUFACTURING ARTICLE

To excel in thermal conductivity and volume resistivity of a silver sintered material formed from a composition including silver fine particles, etc., show high adhesive strength due to excellent shearing stress, and excel in dispersibility of silver particles in the composition; and further, to provide a semiconductor device and articles such as electric/electronic parts, excellent in reliability by using the composition as a joining material.SOLUTION: A composition includes (A) silver fine particles with an average particle diameter of 20-200 nm, (B) silver powder with an average length of 5-20 μm, and (C) an organic solvent. In the composition, a mass ratio between (A) the silver fine particles and (B) the silver powder is 30:70 to 90:10.SELECTED DRAWING: None 【課題】銀微粒子等を含む組成物から形成された銀焼結物の熱伝導性、体積低効率に優れ、せん断応力に優れることで高い接着強度を示し、組成物中の銀粒子の分散性に優れる。さらに、組成物を接合用材料として使用することで信頼性に優れた半導体装置及び電気・電子部品等の物品を提供することである。【解決手段】本発明の組成物は、（Ａ）平均粒径が２０〜２００ｎｍ以下である銀微粒子、（Ｂ）平均長さが５〜２０μｍの銀粉、（Ｃ）有機溶媒を含むことを組成物であって、前記（Ａ）銀微粒子と前記（Ｂ）銀粉の質量比が３０：７０〜９０：１０である組成物である。【選択図】なし