RESIN COMPOSITION FOR SEALING, AND ELECTRONIC COMPONENT DEVICE
To provide a resin composition for sealing having a low curing initiation temperature.SOLUTION: A resin composition for sealing contains a mixed resin composed of an epoxy resin and a phenol curing agent, an inorganic filler, and a curing accelerator, in which the mixed resin contains a resin having...
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| creator | YAMAURA ITARU KANG DONGOL HONG CHANG XUN NAKAMURA TAKEHIRO |
| description | To provide a resin composition for sealing having a low curing initiation temperature.SOLUTION: A resin composition for sealing contains a mixed resin composed of an epoxy resin and a phenol curing agent, an inorganic filler, and a curing accelerator, in which the mixed resin contains a resin having a triphenylmethane skeleton, and a resin having at least one of a phenol aralkyl skeleton and a naphthol aralkyl skeleton.SELECTED DRAWING: None
【課題】硬化開始温度の低い封止用樹脂組成物の提供。【解決手段】エポキシ樹脂及びフェノール硬化剤からなる混合樹脂と、無機充填材と、硬化促進剤と、を含有し、前記混合樹脂が、トリフェニルメタン骨格を有する樹脂と、フェノールアラルキル骨格及びナフトールアラルキル骨格の少なくとも一方を有する樹脂と、を含む封止用樹脂組成物。【選択図】なし |
| format | Patent |
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【課題】硬化開始温度の低い封止用樹脂組成物の提供。【解決手段】エポキシ樹脂及びフェノール硬化剤からなる混合樹脂と、無機充填材と、硬化促進剤と、を含有し、前記混合樹脂が、トリフェニルメタン骨格を有する樹脂と、フェノールアラルキル骨格及びナフトールアラルキル骨格の少なくとも一方を有する樹脂と、を含む封止用樹脂組成物。【選択図】なし</description><language>eng ; jpn</language><subject>CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211227&DB=EPODOC&CC=JP&NR=2021195480A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211227&DB=EPODOC&CC=JP&NR=2021195480A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YAMAURA ITARU</creatorcontrib><creatorcontrib>KANG DONGOL</creatorcontrib><creatorcontrib>HONG CHANG XUN</creatorcontrib><creatorcontrib>NAKAMURA TAKEHIRO</creatorcontrib><title>RESIN COMPOSITION FOR SEALING, AND ELECTRONIC COMPONENT DEVICE</title><description>To provide a resin composition for sealing having a low curing initiation temperature.SOLUTION: A resin composition for sealing contains a mixed resin composed of an epoxy resin and a phenol curing agent, an inorganic filler, and a curing accelerator, in which the mixed resin contains a resin having a triphenylmethane skeleton, and a resin having at least one of a phenol aralkyl skeleton and a naphthol aralkyl skeleton.SELECTED DRAWING: None
【課題】硬化開始温度の低い封止用樹脂組成物の提供。【解決手段】エポキシ樹脂及びフェノール硬化剤からなる混合樹脂と、無機充填材と、硬化促進剤と、を含有し、前記混合樹脂が、トリフェニルメタン骨格を有する樹脂と、フェノールアラルキル骨格及びナフトールアラルキル骨格の少なくとも一方を有する樹脂と、を含む封止用樹脂組成物。【選択図】なし</description><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLALcg329FNw9vcN8A_2DPH091Nw8w9SCHZ19PH0c9dRcPRzUXD1cXUOCfL383SGqPNz9QtRcHEN83R25WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgZGhoaWpiYWBo7GRCkCAKjMKoI</recordid><startdate>20211227</startdate><enddate>20211227</enddate><creator>YAMAURA ITARU</creator><creator>KANG DONGOL</creator><creator>HONG CHANG XUN</creator><creator>NAKAMURA TAKEHIRO</creator><scope>EVB</scope></search><sort><creationdate>20211227</creationdate><title>RESIN COMPOSITION FOR SEALING, AND ELECTRONIC COMPONENT DEVICE</title><author>YAMAURA ITARU ; KANG DONGOL ; HONG CHANG XUN ; NAKAMURA TAKEHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2021195480A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2021</creationdate><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>YAMAURA ITARU</creatorcontrib><creatorcontrib>KANG DONGOL</creatorcontrib><creatorcontrib>HONG CHANG XUN</creatorcontrib><creatorcontrib>NAKAMURA TAKEHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YAMAURA ITARU</au><au>KANG DONGOL</au><au>HONG CHANG XUN</au><au>NAKAMURA TAKEHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>RESIN COMPOSITION FOR SEALING, AND ELECTRONIC COMPONENT DEVICE</title><date>2021-12-27</date><risdate>2021</risdate><abstract>To provide a resin composition for sealing having a low curing initiation temperature.SOLUTION: A resin composition for sealing contains a mixed resin composed of an epoxy resin and a phenol curing agent, an inorganic filler, and a curing accelerator, in which the mixed resin contains a resin having a triphenylmethane skeleton, and a resin having at least one of a phenol aralkyl skeleton and a naphthol aralkyl skeleton.SELECTED DRAWING: None
【課題】硬化開始温度の低い封止用樹脂組成物の提供。【解決手段】エポキシ樹脂及びフェノール硬化剤からなる混合樹脂と、無機充填材と、硬化促進剤と、を含有し、前記混合樹脂が、トリフェニルメタン骨格を有する樹脂と、フェノールアラルキル骨格及びナフトールアラルキル骨格の少なくとも一方を有する樹脂と、を含む封止用樹脂組成物。【選択図】なし</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; jpn |
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| subjects | CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| title | RESIN COMPOSITION FOR SEALING, AND ELECTRONIC COMPONENT DEVICE |
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