RESIN COMPOSITION FOR SEALING, AND ELECTRONIC COMPONENT DEVICE
To provide a resin composition for sealing having a low curing initiation temperature.SOLUTION: A resin composition for sealing contains a mixed resin composed of an epoxy resin and a phenol curing agent, an inorganic filler, and a curing accelerator, in which the mixed resin contains a resin having...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | To provide a resin composition for sealing having a low curing initiation temperature.SOLUTION: A resin composition for sealing contains a mixed resin composed of an epoxy resin and a phenol curing agent, an inorganic filler, and a curing accelerator, in which the mixed resin contains a resin having a triphenylmethane skeleton, and a resin having at least one of a phenol aralkyl skeleton and a naphthol aralkyl skeleton.SELECTED DRAWING: None
【課題】硬化開始温度の低い封止用樹脂組成物の提供。【解決手段】エポキシ樹脂及びフェノール硬化剤からなる混合樹脂と、無機充填材と、硬化促進剤と、を含有し、前記混合樹脂が、トリフェニルメタン骨格を有する樹脂と、フェノールアラルキル骨格及びナフトールアラルキル骨格の少なくとも一方を有する樹脂と、を含む封止用樹脂組成物。【選択図】なし |
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