LASER PROCESSING DEVICE AND PROCESSING METHOD

To provide a laser processing device and processing method in which time required for deburring can be reduced as much as possible.SOLUTION: Laser processing devices (1 and 1B) comprise: an irradiating part (26) that irradiates a work-piece (8) with a laser beam (W); a receiving part (216) that receives a processing pattern and an irradiation condition for the laser beam (W); and a control part (211) that controls irradiation with the laser beam (W). The control part (211) applies deburring processing to the work-piece (8) processed based on the processing pattern, in a processing pattern same as the processing pattern used when processing the work-piece, while shifting a condensing position of the laser beam (W) from a processed surface when processing the work-piece.SELECTED DRAWING: Figure 5 【課題】バリ取りにかかる時間を極力短くすることができるレーザ加工装置および加工方法を提供する。【解決手段】レーザ加工装置（１，１Ｂ）は、レーザ光（Ｗ）を加工対象物（８）に照射する照射部（２６）と、加工パターンとレーザ光（Ｗ）の照射条件とを受け付ける受付部（２１６）と、レーザ光（Ｗ）の照射を制御する制御部（２１１）とを備える。制御部（２１１）は、加工パターンに基づいて加工した加工対象物（８）に対して、レーザ光（Ｗ）の集光位置を加工時の加工面からずらして加工時と同じ加工パターンでバリ取り加工を行う。【選択図】図５