MOUNTING BOARD, SENSOR PACKAGE, AND MANUFACTURING METHOD OF THE SAME

To provide a sensor package in which resin adhesion to components and terminals is prevented, and damage to the board is reduced.SOLUTION: A sensor package 100 includes: an imaging sensor 300; a printed circuit board 200 on which the imaging sensor 300 is mounted; a frame part 400 which is provided on the printed circuit board 200 to surround the imaging sensor 300; and a lid part 500 which is attached to the frame part 400 to cover the imaging sensor 300. The printed circuit board 200 is provided with wire bonding terminal parts composed of a plurality of wire bonding terminals 203 which are electrically connected to the imaging sensor 300. Furthermore, a groove 209 is provided at a predetermined depth between an area where the frame part 400 is provided and the wire bonding terminal part.SELECTED DRAWING: Figure 7 【課題】部品や端子への樹脂の付着が防止され、基板へのダメージが軽減されたセンサパッケージを提供する。【解決手段】センサパッケージ１００は、撮像センサ３００と、撮像センサ３００が実装されるプリント基板２００と、撮像センサ３００を囲むようにプリント基板２００に設けられる枠部４００と、撮像センサ３００を覆うように枠部４００に取り付けられる蓋部５００とを備える。プリント基板２００には、撮像センサ３００と電気的に接続される複数のワイヤボンディング端子２０３からなるワイヤボンディング端子部とが設けられており、更に枠部４００が設けられる領域とワイヤボンディング端子部との間に所定の深さで溝部２０９を設ける。【選択図】図７