SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE

To provide a semiconductor device and a power conversion device that can install a cooler without impairing a function of the semiconductor device.SOLUTION: A semiconductor device includes a heat dissipation unit 1 in which a front metal 1b and a back metal 1c are formed on an insulating member 1a, a first joint unit 5 formed on the front metal 1b, a semiconductor element 2 arranged on the first joint unit 5, a second joint unit 6 formed on the semiconductor element 2, a first main wiring unit 3a connected to the semiconductor element 2 via the second joint unit 6, and a sealing unit 4 that covers at least some of the heat dissipation unit 1, the first joint unit 5, the semiconductor element 2, the second joint unit 6, and the first main wiring unit 3a, and exposes the back metal 1c of the heat dissipation unit 1.SELECTED DRAWING: Figure 2 【課題】半導体装置の機能が損ねることなく、冷却器を設置できる半導体装置及び電力変換装置を提供する。【解決手段】半導体装置において、絶縁部材１ａに表面金属１ｂ、裏面金属１ｃが形成された放熱部１と、表面金属１ｂ上に形成された第１の接合部５と、第１の接合部５上に配置された半導体素子２と、半導体素子２上に形成された第２の接合部６と、第２の接合部６を介して半導体素子２と接続された第１の主配線部３ａと、放熱部１、第１の接合部５、半導体素子２、第２の接合部６及び第１の主配線部３ａの少なくとも一部を覆うとともに、放熱部１の裏面金属１ｃを露出するように形成された封止部４と、を備える。【選択図】図２