METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

To provide a method for manufacturing an electronic component capable of suitably performing processing for collectively sticking sheet-like members to a plurality of chips.SOLUTION: A method for manufacturing an electronic component comprises a first adhesion holding step, a first expanding step, a second adhesion holding step, a second expanding step, and a first processing step. The first adhesion holding step adhesively holds a plurality of chips 22 on a first adhesive sheet 41. The first expanding step expands the first adhesive sheet 41 and holds an interval between the chips 22 as a first chip interval. The second adhesion holding step shifts the plurality of chips 22 from the first adhesive sheet to a second adhesive sheet and adhesively holds the plurality of chips on the second adhesive sheet. The second expanding step expands the second adhesive sheet and holds the interval between the chips 22 as a second chip interval greater than the first chip interval. The first processing step collectively subjects the plurality of chips 22 to the first processing after the second expanding step.SELECTED DRAWING: Figure 15 【課題】複数のチップに一括してシート状部材を貼り付ける加工処理を好適に行うことができる電子部品の製造方法を提供する。【解決手段】複数のチップ２２を第１粘着シート４１に粘着保持する第１粘着保持工程と、第１粘着シート４１を拡張してチップ２２間の間隔を第１チップ間隔に保持する第１拡張工程と、複数のチップ２２を第１粘着シートから第２粘着シートに移し替えて第２粘着シートに粘着保持する第２粘着保持工程と、第２粘着シートを拡張してチップ２２間の間隔を第１チップ間隔よりも大きい第２チップ間隔に保持する第２拡張工程と、第２拡張工程後に、複数のチップ２２に一括して第１加工処理を施す第１加工処理工程と、を備える。【選択図】図１５