FLUID-SEALED ASSEMBLY

To eliminate the necessity for arranging a dimensional surplus amount by taking into consideration a thermal influence at the joining of members and to decrease a device outside diameter D1, in a fluid-sealed assembly.SOLUTION: A fluid-sealed assembly comprises a dish-shaped member 12, a lid-shaped...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: IMAI KUNITOSHI, MOGI TAKASHI
Format: Patent
Sprache:eng ; jpn
Schlagworte:
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