POLISHING DEVICE, PROCESSING SYSTEM, AND POLISHING METHOD

To provide a polishing device which is suitable for surface reference polishing.SOLUTION: A polishing device 100 includes: a plurality of substrate holding mechanisms 200 arranged in a first direction (X direction) of a substrate 300; a plurality of polishing heads 201 arranged in a second direction...

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Bibliographische Detailangaben
Hauptverfasser:	KOBAYASHI KENICHI, AKAZAWA KENICHI, FURUSAWA MANATO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	To provide a polishing device which is suitable for surface reference polishing.SOLUTION: A polishing device 100 includes: a plurality of substrate holding mechanisms 200 arranged in a first direction (X direction) of a substrate 300; a plurality of polishing heads 201 arranged in a second direction (Y direction) crossing the first direction (X direction); a stage 202 extending in the second direction (Y direction) so as to face the plurality of polishing heads 201 across the substrate 300; and driving mechanisms 500 and 600 for moving the plurality of polishing heads 201 and the stage 202 in the first direction (X direction).SELECTED DRAWING: Figure 5 【課題】表面基準研磨に好適な研磨装置を実現する。【解決手段】研磨装置１００は、基板３００の第１の方向（Ｘ方向）に沿って配置された複数の基板保持機構２００と、第１の方向（Ｘ方向）と交差する第２の方向（Ｙ方向）に沿って配置された複数の研磨ヘッド２０１と、基板３００を挟んで複数の研磨ヘッド２０１に対向して第２の方向（Ｙ方向）に伸びるステージ２０２と、複数の研磨ヘッド２０１とステージ２０２を第１の方向（Ｘ方向）に移動させるための駆動機構５００、６００と、を含む。【選択図】図５